IEMT 2022, MALAYSIA

This submission has been ended on 2022-05-08 01:00:00.

Conference Duration : Dec 9, 2021 - Jul 16, 2022

Submission duration : Dec 9, 2021 - May 8, 2022

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Description

IMPORTANT DATE

Abstract Submission Due Date: 15th March, 2022

Abstract Submission Extension Due Date: 15th April, 2022

Abstract Acceptance Notification Date: 1st May, 2022

Full Paper Submission Date: 15th July, 2022

SCOPE OF PAPERS SOLICITED

Abstract should include original and previously unpublished, non-confidential and non-commercial information on new developments, technology and knowledge in the areas including, but not limited to those given below.

  1. Advanced Packaging – 2D, 2.5D, 3.0D, Chiplets, WLCSP, FOWLP, FOPLP & Heterogeneous Integrations
  2. Thermal/Mechanical/Electrical Simulation & Characterization
  3. Material & Processing
  4. Emerging Packaging – Opto, Medical, Nano Technology, Wearable Electronics
  5. Interconnections Technologies – TSV, µ-bump, hybrid bond, FC and embedded
  6. LED, MEM & Sensor Packaging & IoT
  7. IC Testing Technology
  8. Surface Mount Technology
  9. Quality, Reliability & Failure Analysis
  10. High-Speed, Wireless & Components

Abstract is limited to 250-750 words that describes the scope, content, and key points of your proposed paper. Abstracts must be received electronically by March 15th, 2022, (extension due date April 15th, 2022) through the link https://in.explara.com/submix/iemt-2022. Review articles will not be accepted.

If you have any questions, contact:

Email: IEMTMalaysia@gmail.com

IEMT2022 URL: https://iemt.com.my/

Topics

Assembly and Manufacturing Technology

Material and Processing

LED,MEM and Sensor Packaging and IoT

IC Testing Technology

Surface Mount Technology

Quality, Reliability and Failure Analysis

High-Speed, Wireless and Components

Thermal/Mechanical/Electrical Simulation and Characterization

Advanced Packaging – 2.5D, 3.0D, TSV, interposer, flip-chip, SiP, PoP, FOWLP, FOPLP, embedded and advanced substrates, heterogeneous integration.

Emerging Packaging and Interconnections Technologies – Opto-electronics, Medical Electronics, Nano Technology, Wearable Electronics.

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