IEMT 2020, MALAYSIA

This submission has been ended on 2020-04-20 16:00:00.

Conference Duration : Sep 28, 2020 - Sep 30, 2020

Submission duration : Oct 18, 2019 - Apr 20, 2020

Description

IMPORTANT DATE

Abstract Submission Due Date: Feb 28th, 2020

Abstract Submission Due Extension: Mar 15th, 2020

Abstract Submission Due 2nd Extension: Mar 31st, 2020

Abstract Acceptance Notification Date: Apr 15th, 2020

Full Paper Submission Date: May 31st, 2020

SCOPE OF PAPERS SOLICITED

Abstract should include original and previously unpublished, non-confidential and non-commercial information on new developments, technology and knowledge in the areas including, but not limited to those given below.

  1. Advanced Packaging – 2.5D, 3.0D, TSV, interposer, flip-chip, SiP, PoP, FOWLP, FOPLP, embedded & advanced substrates, heterogeneous integration.
  2. Assembly and Manufacturing Technology
  3. Thermal/Mechanical/Electrical Simulation & Characterization
  4. Material & Processing
  5. Emerging Packaging & Interconnections Technologies – Opto-electronics, Medical Electronics, Nano Technology, Wearable Electronics.
  6. LED,MEM & Sensor Packaging & IoT
  7. IC Testing Technology
  8. Surface Mount Technology
  9. Quality, Reliability & Failure Analysis
  10. High-Speed, Wireless & Components

Abstract are limited to 250-750 words that describes the scope, content, and key points of your proposed paper. Additional details on abstract format and how to submit abstract electronically can be found on the IEMT 2020 website under the ‘Author” tab. Abstracts must be received by March 1st, 2020. All abstracts must be submitted electronically. Review articles will not be accepted.

This year, we are introducing mentoring session to improve the full paper quality. Drop us email for those who are interested to be the mentor or mentee. 

TOPICS YOU DON’T WANT TO MISS

Plenary Speech

  • Packaging Technology and AI
  • 5G Technologies and Applications
  • IoT and Big Data

Special Session

  • Heterogeneous Integration Forum / Wafer Level Packaging / 3D SiP Integration
  • Student career prospective talks by industry leaders – Share your Life story / The
  • Role models (Fully Sponsor for University Students)

Industry Session

  • Power Modules for HEV/EV, Automotive packaging Forum

Additional details on how to submit abstract electronically can be found on the IEMT 2020 website. This year, we are introducing mentoring session to improve the full paper quality. Drop us email for those who are interested to be the mentor or mentee.

If you have any questions, contact:

Email: IEMTMalaysia@gmail.com

IEMT2020 URL: https://iemt.com.my/

Topics

Assembly and Manufacturing Technology

Material and Processing

LED,MEM and Sensor Packaging and IoT

IC Testing Technology

Surface Mount Technology

Quality, Reliability and Failure Analysis

High-Speed, Wireless and Components

Thermal/Mechanical/Electrical Simulation and Characterization

Advanced Packaging – 2.5D, 3.0D, TSV, interposer, flip-chip, SiP, PoP, FOWLP, FOPLP, embedded and advanced substrates, heterogeneous integration.

Emerging Packaging and Interconnections Technologies – Opto-electronics, Medical Electronics, Nano Technology, Wearable Electronics.

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